Scantinel is a world-leading FMCW LiDAR start-up company, headquartered in Ulm, Baden-Württemberg, Germany. Incubated in the global optics leader Carl Zeiss AG in 2016, Scantinel spun off as an independent company in 2019 backed by ZEISS Ventures, Scania Growth Capital and PhotonDelta. In January 2026, Scantinel became a subsidiary of MicroVision, Inc.
We are building best-in-class FMCW LiDAR technology for future mobility applications. FMCW LiDAR systems will help create unparalleled safety level in automotive, mobility, trucking, and for industrial application.
Deine Aufgaben
Create the photonic packaging concept for advanced integrated optical sensors
Define and implement wafer level hybrid integration processes for optoelectronic components in Photonic packages
Define and implement chip and module packaging specifications
Develop assembly processes for high precision optical components
Test and qualify of the packaged components
Select strategic partners and sub-contractors for wafer level, chip and module packaging
Dein Profil
A Master or PhD in engineering or fundamental science
A few years of experience in photonic packaging, photonic integration and integrated optics
Expert knowledge of photonic packaging processes as well as industry insights to photonic packaging houses
Experience in cooperation with external partners
Willingness of working in fast-moving environments with high levels of ambiguity and rapidly changing markets as well as a ‘hands-on-attitude’
Fluent in English, German is a plus
Semiconductor Packaging Specialist (w/m/d)
Ulm, Permanent employee
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ZEISS Ventures has been committed to us from our inception. And in May 2021, Scania Growth Capital joined as an investor. This investment has been made because of Scantinel's technology leadership in its field and the progress of autonomous technologies in the heavy truck industry. In November 2022, PhotonDelta, a leading photonics eco-system joined as a new investor.