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Scantinel launches FMCW LiDAR silicon chip

Scantinel Photonics launches groundbreaking solid-state scanning FMCW LiDAR silicon chip for autonomous vehicles

Ulm, Germany, February 16, 2021 – Scantinel Photonics, a global leading FMCW LiDAR Company, launches the first chip-scale Optical Enhanced Array (OEA™) LiDAR scanning system based on Photonic Integrated Circuit (PIC). The PIC has 256 channels and enables full performance of long range (> 300m) detection with solid-state scanning.

The development and fabrication of the PIC was made in cooperation with Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies. A CMOS-compatible fabrication of the PIC at wafer-level significantly reduces cost, size, weight, and power consumption of a LiDAR system and can be scaled for high volume applications, like autonomous vehicles. Using standard CMOS fabs gives Scantinel the compelling advantage of building FMCW LiDAR on Chip at a highly attractive and competitive price.

"Our unique OEA™ system is combining the PIC with Scantinel’s proprietary optics, which is truly a groundbreaking development", said Vladimir Davydenko, Co-Founder and Lead Architect Ranging Systems of Scantinel. "The first FMCW LiDAR demonstrator using the PIC with the OEA™ system will be available by mid of this year" added Dr. Michael Richter – Managing Director of Scantinel Photonics.

Michael Richter

CONTACT:
Dr. Michael Richter

Phone: +49 731 7908 2690 
press@scantinel.com

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